In production you would profile the boards. You take a board and run it through the oven with some thermocouples. You'd then set the temperatures of the pre-heat, heat, and cool down sections. This would heat the solder to melting point without putting too much stress on the components.
This is from memory from a long time ago using a teeny tiny little pick and place machine that did a few thousand components per hour.
BGAs were always always horrible to do.
"Design for production" is really very important and it's hard to find much information about it. Some simple little things can make the difference between an operator having to plonk a component on the board by hand every time just before it goes into the oven or having the machine do it. (Again, from memory).
In production you would profile the boards. You take a board and run it through the oven with some thermocouples. You'd then set the temperatures of the pre-heat, heat, and cool down sections. This would heat the solder to melting point without putting too much stress on the components.
This is from memory from a long time ago using a teeny tiny little pick and place machine that did a few thousand components per hour.
BGAs were always always horrible to do.
"Design for production" is really very important and it's hard to find much information about it. Some simple little things can make the difference between an operator having to plonk a component on the board by hand every time just before it goes into the oven or having the machine do it. (Again, from memory).