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What I can see on the other hand is some packages end up being dropped into the PCB and soldered at the sides.

That's been done for at least 30 years:

https://www.keesvandersanden.nl/calculators/hp32sii_repair.p...



That's amazing and I'm glad that it's possible, even by the standards of older technology. I certainly think dropping packages into the PCB is the lowest hanging fruit for reducing depth.




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